Just one module with significant UPH increases for a multitude of Integrated dispense axis enables parallel dispensing and bonding in Next to flux film application via slide fluxer an (optionally) Flexibility - Even the standard module of the 2200 evo die bonders can be very variably equipped.The 2200 evo is easy to learn - just as used for the 2200 platform.ĭata transfer via TCP/IP networks is naturally implemented, and the Despite the wide range of fittings and set-up options, operation of Key specifications - Die handling from 0,17 mm - 50 mm, Placement accuracy of ☑0 µm 3s (cmk = 1,33). Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space.Multi-chip module - Flip chip and die attach tasks can be executed in just one module.Machine - UPH can be optionally multiplied. (dispensing and bonding) can be arranged consecutively to a single With the globally unique platform concept up to 4 axis systems
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